View TB6549PG_8582988.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tb6549fg/pg/hq 2010-07-13 1 toshiba bi-cmos integrated circuit silicon monolithic tb6549fg, TB6549PG,tb6549hq full-bridge driver ic for dc motors the tb6549fg/pg/hq is a full-bridge driver ic for dc motors that uses an ldmos structure for output transistors. high-efficiency drive is possib le through the use of a mos process with low on-resistance and a pwm drive system. four modes, cw, ccw, short brake, and stop, can be selected using in1 and in2. features ? power supply voltage: 30 v (max) ? output current: 3.5 a (max) (fg,pg type)/4.5 a (max.) (hq type) ? low on-resistance: 1.0 ? (up + low/typ.) ? pwm control capability ? standby system ? function modes: cw/ccw/short brake/stop ? built-in overcurrent protection ? built-in thermal shutdown circuit ? package: hsop20/dip16/hzip25 the tb6549hq is a sn-plated product. (the pb-containing materials with a high melting point that are exempted from rohs directives are used inside the ic.) note: this product has a mos structure and is sensitive to electrostatic discharge. when handling this product, ensure that the environment is protec ted against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient te mperature and relative humidity are maintained at reasonable levels. tb6549fg TB6549PG tb6549hq weight hsop20-p-450-1.00: 0.79 g (typ.) dip16-p-300-2.54a: 1.11 g (typ.) hzip25-p-1.00f: 7.7g (typ.) hzip25-p-1.00f about solderability, the following conditions were confirmed (1)use of sn-37pb solder bath solder bath temperature: 230 dipping time: 5 seconds the number of times: once use of r-type flux (2)use of sn-3.0ag-0.5cu solder bath solder bath temperature: 245 dipping time: 5 seconds the number of times: once use of r-type flux
tb6549fg/pg/hq 2010-07-13 2 pin assignment nc ccpa ccpb ccpc nc s-gnd ( fin ) nc in1 in2 nc out1 v cc nc v reg sb nc s-gnd (fin) nc pwm nc out2 p-gnd hsop20-p-450-1.00 ccpa ccpb ccpc s-gnd s-gnd in1 in2 out1 v cc v reg sb s-gnd s-gnd pwm out2 p-gnd dip16-p-300-2.54a p - g n d s - g n d s - g n d o u t 2 n c o u t 1 p w m s b v r e g v c c c c p a c c p b c c p c i n 1 i n 2 n c n c n c n c n c n c n c n c n c n c hzip25-p-1.00f
tb6549fg/pg/hq 2010-07-13 3 block diagram some functional blocks, circuits or cons tants may be omitted or simplified in this block diagram for explanatory purposes. pin functions * ) (hq type) 4, 5, 7, 8, 9, 13, 17, 18, 19, 21, 22 ;n.c. pin no. fg pg hq pin name functional description remarks 1 ? ? (nc) no connection ? 2 1 1 ccpa capacitor connection pin for char ge pump a connect a capacitor for charge pump 3 2 2 ccpb capacitor connection pin for char ge pump b connect a capacitor for charge pump 4 3 3 ccpc capacitor connection pin for char ge pump c connect a capacitor for charge pump 5 ? ? (nc) no connection ? 6 ? ? (nc) no connection ? 7 6 10 in1 control signal input 1 input 0/5-v signal 8 7 11 in2 control signal input 2 input 0/5-v signal 9 ? ? (nc) no connection ? 10 8 12 out1 output pin 1 connect to motor coil pin 11 9 14 p-gnd power gnd ? 12 10 15 out2 output pin 2 connect to motor coil pin 13 ? ? (nc) no connection ? 14 11 16 pwm pwm control signal i nput pin input 0/5-v pwm signal 15 ? ? (nc) no connection ? 16 ? ? (nc) no connection ? 17 14 23 sb standby pin h: start, l: standby 18 15 24 v reg 5 v output pin connect a capacitor to s-gnd 19 ? ? (nc) no connection ? 20 16 25 v cc power supply input pin v cc (ope) 10 to 27 v fin 4,5,12,13 6, 20 s-gnd gnd pin ? control logic overcurrent detecting circuit t sd osc 5 v in1 in2 p-gnd out1 out2 sb v cc s-gnd v reg ccpa ccpb ccpc charge pump circuit pwm
tb6549fg/pg/hq 2010-07-13 4 absolute maximum ratings (t a = 25c) characteristic symbol rating unit supply voltage v cc 30 v fg, pg 3.5 (note1) i o (pulse) hq 4.5 (note2) fg, pg 2.0 output current i o (dc) hq 3.5 a input voltage vin ? 0.3 to 5.5 v fg 2.5 (note3) pg 2.7 (note4) power dissipation 3.2 (note5) hq p d 40 (note6) w operating temperature t opr ?20 to 85 c storage temperature t stg ?55 to 150 c note1: the absolute maximum ratings must be observed strict ly. make sure that no characteristic listed above ever exceeds the absolute maximum rating. note2: t = 100 ms note3: this value is obtained for a 115 mm 75 mm 1.6 mm pcb mounting with 30% copper area. note4: this value is obtained for a 50 mm 50 mm 1.6 mm pcb mounting with 50% copper area. note5: ic only. note6: infinite heat sink. operating ranges (t a = 25c) characteristic symbol rating unit supply voltage v cc 10 to 27 v pwm frequency f clk 100 khz
tb6549fg/pg/hq 2010-07-13 5 electrical characteristics (v cc = 24 v, t a = 25c) characteristic symbol test circuit test condition min typ. max unit i cc1 stop mode ? 4 8 i cc2 cw/ccw mode ? 6 10 i cc3 short brake mode ? 4 8 supply current i cc4 1 standby mode ? 1 2 ma v inh 2 ? 5.5 input voltage v inl 2 0 ? 0.8 hysteresis voltage v in (hys) ? (not tested) ? 0.2 ? v i inh v in = 5 v ? 50 75 control circuit input current i inl 1 v in = 0 v ? ? 5 a v pwmh 2 ? 5.5 input voltage v pwml 3 ? ? 0.8 hysteresis voltage v pwm(hys) ? (not tested) ? 0.2 ? v i pwmh v pwm = 5 v ? 50 75 input current i pwml 3 v pwm = 0 v ? ? 5 a pwm frequency f pwm duty = 50% ? ? 100 khz pwm input circuit minimum clock pulse width tw( pwm) 3 2 ? ? s v insh 2 ? 5.5 input voltage v insl 2 ? ? 0.8 hysteresis voltage v in (hys) ? (not tested) 0.2 ? v i insh v in = 5 v ? 50 75 standby circuit input current i insl 1 v in = 0 v ? ? 5 a i o = 0.2 a ? 1.0 1.75 output on-resistance r on (u ? l) 4 i o = 1.5 a ? 1.0 1.75 i l (u) v cc = 30 v (note 1) ? ? 150 output leakage current i l (l) 5 v cc = 30 v ? ? 10 a v f (u) i o = 1.5 a 1.3 1.7 diode forward voltage v f (l) 6 i o = 1.5 a 1.3 1.7 v internal reference voltage v reg 4 no load 4.5 5 5.5 v overcurrent detection offset time i sd (off) ? (not tested) ? 50 ? s charge pump rising time t ong 7 c 1 = 0.22 f, c 2 = 0.01 f (note 2) ? 1 3 ms thermal shutdown circuit operating temperature t sd ? (not tested) ? 160 ? c note 1: include the current in the circuit. note 2: c 1 is a capacitor between ccpa and gnd. c 2 is a capacitor between ccpb and ccpc.
tb6549fg/pg/hq 2010-07-13 6 component description 1. control input/pwm input circuit ? the input signals are shown below. input at the cmos and ttl levels can be provided. note that the input signals have a hysteresis of 0.2 v (typ.). v inh : 2 to 5.5 v v inl : gnd to 0.8 v ? the pwm input frequency should be 100 khz or less. input/output function input output in1 in2 sb pwm out1 out2 mode h h h h l l l short brake h l h cw/ccw l h h l l l short brake h h l ccw/cw h l h l l l short brake h l l h l off (high impedance) stop h h/l h/l l l off (high impedance) standby ? pwm control function motor speed can be controlled by inputting the 0/5-v pwm signal to the pwm pin. when pwm control is provided, normal operat ion and short brake operation are repeated. if the upper and lower power transist ors in the output circuit were on at the same time, a penetrating current would be produced. to prevent this current from being produced, a dead time of 300 ns (design target value) is provided in the ic when either of th e transistors changes from on to off, or vice versa. therefore, pwm control by synchronous rectification is enabled without an off time being inserted by external input. note that a dead time is also provid ed in the ic at the time of transition between cw and ccw or between cw (ccw) and short brake mode , thereby eliminating the need for an off time. v reg 100 k in1 (in2, pwm) sur g e p rotection v reg
tb6549fg/pg/hq 2010-07-13 7 note: be sure to set the pi n pwm to high when the pwm control function is not used. 2. standby circuit ? all circuits are turned off except the standby circuit and the charge pump circuit under the standby condition. ? the input voltage range is shown below. input at cm os and ttl level is possible. the input signal has 0.2 v (typ.) hysteresis. v insh : 2 to v reg v v insl : gnd to 0.8 v ? do not attempt to the control the output by inputti ng pwm signals to the standby pin. doing so may cause the output signal to become unstable, resulting in destruction of the ic. (the charge pump circuit is turned on/off by the switch of the input signal from the standb y pin. if the switching cycle is shorter than 50 ms, the charge pump circuit w ill not operate with precis e timing. therefore the switching cycle of the standby pin should be longer than 50 ms.) when the standby condition is changed to operation mode, set in1 and in2 to low level (stop mode) at first. then switch in1 and in2 to high level when the charge pump circuit reaches the stable condition, i.e., when vcpa is about v cc + 5 v. v dd v dd 100 k sb pwm on t5 v cc m gnd out1 v cc m gnd pwm off t3 out1 v cc m gnd pwm on t1 out1 v cc m gnd pwm on off t2 = 300 ns (typ.) out1 v cc m gnd pwm off on t4 = 300 ns (typ.) out1 gnd v cc output voltage waveform (out1) t1 t2 t3 t5 t4
tb6549fg/pg/hq 2010-07-13 8 3. internal constant-voltage (5 v) circuit ? this ic includes a 5 v power supply for control circuit. ? a capacitor for prevention of osc illation should be connected to s-gnd associated with the pin v reg . no other loads should be connected to pin v reg . ? this ic has a power monitoring functi on and turns the output off when v reg goes down to 3.0 v (design target value) or less. with a hysteresis of 0.3 v (design target value), the output are turned on when v reg again reaches 3.3 v (design target value). 4. charge pump circuit ? this ic has a charge pump circuit for driving the gate for the upper power transistor in the output circuit. a voltage of v cc + 5 v (typ.) is generated by connecti ng an external capacitor to this ic. it takes about 2 ms to boost vcpa up v cc + 5 v (typ.) after the switching of the input signal from the standby pin (while ccpa = 0.22 f, and ccpb and ccpc are connected through 0.01 f). ? the proper capacitance of the external capacitor varies depending on the v cc value. thus, determine the constant by referring to the following data. the value of the capacitor between ccpb and ccpc should be such that, while the motor is being driven , the voltage on the ccpa pin will be kept constant, typically at v cc + 5 v. (if a reduced v cc level causes the voltage on ccpa to start to fall, please adjust this capacitance value accordingly.) < external capacitor > v cc between ccpb and ccpc between ccpa and gnd 10 v to 15 v 0.01 f to 0.047 f 0.22 f 15 v to 27 v 0.01 f 0.22 f ? reference oscillation is performed by using the internal capacitor. v cc v reg v cc ccpc v cc ccpb ccpa
tb6549fg/pg/hq 2010-07-13 9 5. output circuit ? this ic uses nch mos transistors as the upper and lower transistors in the output circuit. ? as output r on is 1 (sum for the upper and lower parts/typ.), this ic is a device of the low-r on type. ? the switching characteristics of the output transistors are shown below. item typical value unit t plh 350 t phl 800 t r 60 t f 100 ns *: out 1, out 2; open v cc out1 (out2) p-gnd output voltage (out1/out2) 90 10 50 t plh t r 50 t phl 90 10 t f pwm input t r t plh (350 ns) (60 ns) pwm input output voltage t plh (800 ns) (100 ns) t f
tb6549fg/pg/hq 2010-07-13 10 6. v cc power supply section ? the v cc power supply delivers a voltage to the output circuit, charge pump circuit, and internal 5 v circuit. ? the operating voltage range is shown below: v cc (opr.) = 10 to 27 v ? this ic has a power monitoring function for preven ting an output malfunction on power-up. however, toshiba recommends that in1, in2, and sb be set to the low level at power-on. 7. gnd sections ? this ic includes two separate gnd sections: s-gnd for controlling and p-gnd for outputting. be sure to short-circuit these two gnds as close to tb6549 as possible. 8. power monitoring circuit ? this circuit turns the output off when v reg becomes 3.0 v (design target value) or less. at this time, v cc = 4.6 v (typ.). ? with a hysteresis of 0.3 v (design target value), the output turns back on when v reg exceeds 3.3 v (design target value) after th is circuit starts operating. 9. thermal shutdown (t sd ) circuit this ic includes a thermal shutdown circuit, which turns the output off when the junction temperature (tj) exceeds 160c (typ.). the output turns back on automatically. the thermal hysteresis is 20c. t sd = 160c (design target value) t sd = 20c (design target value) 10. overcurrent detection (i sd ) circuit this ic includes a circuit to detect current flowing through the output power transistors. the current limit is set to 5 a (typ.). the circuit detects a current flowing through each of the four output power transistors. if the current in any one output power transistor ex ceeds the set limit, this circuit turns all the outputs off. this circuit includes a timer that causes the outputs to be off for 50 s (typ.) after detection of an overcurrent and then turn back on automatically. if the overcurrent continues to flow, this on-off operation is repeated. note that to prevent a malfunction due to a glitch, an insensitive period of 10 s (typ.) is provided. the set limit is 5 a (typ.) as a design target valu e. the distributions shown below exist because of the variations in thermal characteristics of different ics. these distributions should be fully considered in the motor torque design. also, output peak current should be less than 3 a because of the variations below, detected current: approximately from 3.5 to 6.5 a i lim 50 s (typ.) 0 10 s (typ.) insensitive period 50 s (typ.) 10 s (typ.) output current
tb6549fg/pg/hq 2010-07-13 11 test circuit 1. i cc1 , i cc2 , i cc3 , i cc4 , i inh , i inl , i insh , i insl ? i cc1 : in1 = 0 v, in2 = 0 v, sb = 5 v ? i cc2 : in1 = 5 v, in2 = 5 v, sb = 5 v or in1 = 0 v, in2 = 5 v, sb = 5 v ? i cc3 : in1 = 5 v, in2 = 5 v, sb = 5 v ? i cc4 : in1 = 5 v/0 v, in2 = 5 v/0 v, sb = 0 v ? i inh : in1 = 5 v, and in2 = 5 v ? i inl : in2 = 0 v, and in2 = 0 v ? i insh : sb = 5 v ? i insl : sb = 0 v 2. v inh , v inl , v insh , v insl ? v inh , v insh : in1 = in2 = sb = 2 v. verify that out1 = out2 = l. ? v inl : in1 = 0.8 v, in2 = sb = 2 v. verify that out1 = l, out2 = h. in1 = sb = 2 v, in2 = 0.8 v. verify that out1 = out2 = l. ? v insl : in1 = in2 = 2 v, sb = 0.8 v. verify that the output function is high impedance. 5v 5v/0v 5v/0v 5v/0v a i cc 24v v cc v reg ccpc ccpb ccpa pwm a in1 i in a in2 i in a sb i ins p-gnd s-gnd out1 out2 tb6549p v 24v v cc v reg ccpc ccpb ccpa pwm 5v in1 2v/0.8v in2 0.8v/2v sb 2v/0.8v p-gnd s-gnd out1 out2 tb6549p v tb6549fg/pg / hq tb6549fg/pg / hq
tb6549fg/pg/hq 2010-07-13 12 3. v pwmh , v pwml , i pwmh , i pwml , f pwm , tw (pwm) ? v pwmh , v pwml , f pwm : pwm = 2 v/0.8 v, 100 khz; duty: 50 % (rectangular wave). verify out1. ? v pwmh , v pwml : pwm = 5 v or pwm = 0 v. ? tw (pwm) : pwm = 2 v/0.8 v, 100 khz; duty: 20 % (2 s) (2 s/rectangular wave). verify out1. 4. r on (u + l) , v reg ? r on (u + l) : measure vds (the sum of upper and lower sides) at i o = 0.2 a, and convert to resistor. do the same at i o = 1.5 a. ? v reg : v reg pin voltage. 24v v cc v reg ccpc ccpb ccpa pwm 5v/0v in1 100khz 5v in2 0v sb 5v p-gnd s-gnd tb6549p v out1 out2 v a i pwm 2v/0.8v v 24v v cc v reg ccpc ccpb ccpa pwm in1 in2 0v/5v sb 5v p-gnd s-gnd out1 out2 tb6549f/p v v 5v 5v/0v i o i o tb6549fg/p/pg tb6549fg/pg / hq tb6549fg/pg/hq
tb6549fg/pg/hq 2010-07-13 13 5. i l (u) , i l (l) 6. v f (u) , v f (l) ? v f (u) , v f (l) : i o = 1.5 a. a 30v v cc v reg ccpc ccpb ccpa pwm in1 in2 0v sb 5v p-gnd s-gnd out1 out2 tb6549f/p 5v 0v i l(u) a i l(l) v 24v v cc v reg ccpc ccpb ccpa pwm in1 in2 0v sb 5v p-gnd s-gnd out1 out2 tb6549f/p v v 5v 0v i o i o v f(l) v f(u) tb6549fg/pg tb6549fg/pg tb6549fg/pg / hq tb6549fg/pg / hq
tb6549fg/pg/hq 2010-07-13 14 7. t ong ? t ong : sb = 0 v 5 v. measure the time taken to boost the ccpa voltage up to about 29 v (24 v + 5 v). 24v v cc v reg ccpc ccpb ccpa pwm 5v in1 0v in2 0v sb 0v 5v p-gnd s-gnd out1 out2 tb6549f/p v tb6549fg/pg tb6549fg/pg / hq
tb6549fg/pg/hq 2010-07-13 15 characteristics curves external attachments symbol use recommended value remarks c 1 charge pump 0.22 f ? 0.01 f v cc = 24 v (note) c 2 charge pump 0.033 f v cc = 12 v (note) c 3 prevention of v reg oscillation 0.1 f to 1.0 f ? c 4 absorption of power noise 0.1 f to 1.0 f ? c 5 absorption of power noise 50 f to 100 f ? note: the recommended values for charge pumps depend on the v cc value. refer to component description 4, charge pump circuit. power dissipation p d (w) p d ? t a (TB6549PG) ambient temperature t a (c) (1) when mounted on a pcb (50 mm 50 mm 1.6 mm glass-epoxy pcb mounting with 50% copper area) (2) ic only (1) (2) 0 0 3.0 240 40 80 120 160 200 0.6 1.2 1.8 2.4 ambient temperature t a (c) p d ? t a (tb6549fg) maximum power dissipation p d max (w) 0 0 50 100 150 200 2 4 6 infinite heat sink (note) no heat sink thermal resistance r th (j-c) = 13c/w r th (j-a) = 130c/w note: 50 mm 50 mm 1 mm fe heat sink p d ? t a tb6549hq ambient temperature t a (c) power dissipation p d (w) 25 0 150 0 80 75 40 100 20 60 50 125 infinite heat sink r j-c = 1c/w heat sink (r hs = 3.5c/w) r j-c + r hs = 4.5c/w ic only r j-a = 39c/w
tb6549fg/pg/hq 2010-07-13 16 typical application diagram note 1: connect v cc and p-gnd through the power supply capacitor. this capacitor should be as close as possible to the ic. note 2: when connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor for limiting the charge current. the switching loss increases for pwm control. therefore, whenever practicable, avoid connecting the capac itor if pwm control is required. note 3: short-circuit s-gnd and p-gnd as close to the tb6549 as possible. note 4: connect the capacitor c 3 to s-gnd. note 5: connect the capacitors c 1 and c 2 as close to the tb6549 as possible, and the capacitor c 1 as close to s-gnd. note 6: pins 4, 5, 12, and 13 of the pg type are connec ted to the bed of the chip. therefore expanding the round area of these pins improves the heat radiation effect. usage precautions ? utmost care is necessary in the design of the output, v cc , and gnd lines since the ic may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. ? be sure to install the ic correctly. the ic may be destroyed if installed wrongly (e.g., in reverse). tb6549fg: pins 1, 5, 6, 9, 13, 15, 16, and 19 are not connected. tb6549hq: pins 4, 6, 8, 9, 13, 17, 18, 20, 21, and 22 are not connected. microcontroller note 2 note 3 note 4 note 6 in2 in1 s-gnd out1 out2 sb fin/4,5,12,13,6, 20 tb6549 gnd 5 v v dd v cc 11/9/14 24v note1 port1 port2 port3 p-gnd v reg 3/2/2 4/3/3 ccpa ccpb ccpc pwm 20/16/25 pwm 18/15/24 2/1/1 c 1 c 2 c 3 c 4 c 5 tb6549fg/TB6549PG/tb6549hq 14/11/16 7/6/10 17/14/23 8/7/11 m fuse 10/8/12 12/10/15 note 5
tb6549fg/pg/hq 2010-07-13 17 package dimensions weight: 0.79 g (typ.)
tb6549fg/pg/hq 2010-07-13 18 package dimensions weight: 1.11 g (typ.)
tb6549fg/pg/hq 2010-07-13 19 package dimensions weight: 7.7 g (typ.) hzip25-1.00f unit: mm
tb6549fg/pg/hq 2010-07-13 20 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
tb6549fg/pg/hq 2010-07-13 21 points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as cu rrent limiter circuits) do not necessarily protect ics under all circumstances. if the over current protection circuits operate against the over current, clear the over current status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (4) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, ta ke the effect of back-emf into consideration in system design.
tb6549fg/pg/hq 2010-07-13 22 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

▲Up To Search▲

Price & Availability of TB6549PG

	To Download TB6549PG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .